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RF/IF & RFID
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Xilinx Inc.(2351)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Reach Compliance Code | Frequency | Width | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Supply Voltage-Max (Vsup) | Core Architecture | Speed | Memory Type | Core Processor | RAM Size | Number of I/O | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | Primary Attributes | Speed Grade | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z007S-1CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 400 | 17mm | ROHS3 Compliant | 400-LFBGA, CSPBGA | 17mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 100 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 23K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XCZU4CG-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | S-PBGA-B784 | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
| XC7Z100-2FFG900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 31mm | ROHS3 Compliant | Copper, Silver, Tin | No | 900 | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | -40°C~100°C TJ | CMOS | 3.35mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z100 | 1mm | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 212 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 444K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||
| XC7Z014S-2CLG484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 484 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B484 | 0.95V | 1.05V | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 200 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XC7Z030-2FBG484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 484 | EAR99 | 23mm | ROHS3 Compliant | No | 484 | 484-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 0°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1V | 30 | XC7Z030 | YES | 1mm | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||
| XCZU4CG-1FBVB900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-1CLG485C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 485 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | 0°C~85°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B485 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 150 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 55K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XC7Z014S-1CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 400 | 17mm | ROHS3 Compliant | 400-LFBGA, CSPBGA | 17mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 125 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XC7Z030-1FBG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676 | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z030 | YES | 1mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||
| XC7Z045-2FFG900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | 3A991.D | 1V | 31mm | ROHS3 Compliant | Copper, Silver, Tin | No | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | -40°C~100°C TJ | CMOS | 3.35mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | S-PBGA-B900 | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||
| XC7Z100-2FFG1156I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 3A991.D | 35mm | ROHS3 Compliant | Copper, Silver, Tin | 1156-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | not_compliant | 800MHz | -40°C~100°C TJ | CMOS | 3.1mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | 1mm | S-PBGA-B1156 | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 250 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 444K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||
| XC7Z012S-1CLG485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 485 | 19mm | ROHS3 Compliant | 484-LFBGA, CSPBGA | 19mm | -40°C~100°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B485 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 150 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 55K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XC7Z014S-1CLG400C | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2016 | Zynq®-7000 | yes | Active | 3 (168 Hours) | 400 | 17mm | ROHS3 Compliant | 400-LFBGA, CSPBGA | 17mm | 0°C~85°C TJ | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B400 | 0.95V | 1.05V | 667MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 125 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||
| XC7Z020-2CLG400I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | -40°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||
| XC7Z020-2CLG484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 484 | 3A991.D | 1V | 19mm | ROHS3 Compliant | Copper, Silver, Tin | No | 484 | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | -40°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||
| XC7Z020-3CLG400E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 866MHz | 0°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -3 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||
| XC7Z020-3CLG484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 484 | 3A991.D | 1V | 19mm | ROHS3 Compliant | Copper, Silver, Tin | No | 484 | 484-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 866MHz | 0°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -3 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||
| XCZU2EG-1SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-2SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| XC7Z030-1FB484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Bulk | 2009 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 484 | ROHS3 Compliant | GPIO WITH FOUR 32-BIT BANKS | 484-BBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.39.00.01 | BOTTOM | BALL | YES | S-PBGA-B484 | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | MCU, FPGA | DMA | 667MHz | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||
| XCZU2CG-2SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| XCZU2CG-2SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
| XCZU2EG-1SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| XAZU2EG-1SFVA625I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | 21mm | ROHS3 Compliant | 625-BFBGA, FCBGA | 21mm | -40°C~100°C TJ | CMOS | 3.43mm | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B625 | 500MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 1.2MB | 128 | MPU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, I2C, SPI, UART/USART, USB | |||||||||||||||||||||||||||||
| XCZU2CG-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | S-PBGA-B784 | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||
| XCZU2EG-2SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| XCZU2CG-L2SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | ROHS3 Compliant | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 784-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | S-PBGA-B784 | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||
| XCZU2CG-1SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |