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  • 10AS066K3F35I3SGES

10AS066K3F35I3SGES

-40°C~100°C TJ System On ChipArria 10 SX Series 396 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-10AS066K3F35I3SGES
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 789
  • Description: -40°C~100°C TJ System On ChipArria 10 SX Series 396 I/O(Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA, FC (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 396
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 660K Logic Elements

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Arria 10 SX series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.In addition, this SoC security combines FPGA - 660K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 396 I/Os.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS066K3F35I3SGES System On Chip (SoC) applications.

  • Self-aware system-on-chip (SoC)
  • POS Terminals
  • Remote control
  • Communication interfaces ( I2C, SPI )
  • Multiprocessor system-on-chips (MPSoCs)
  • Keyboard
  • Embedded systems
  • Measurement testers
  • Avionics
  • Microcontroller