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  • 1SX280LU3F50E1VG

1SX280LU3F50E1VG

0°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX280LU3F50E1VG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 361
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 704 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 2397-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 704
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2800K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor.There is a 2397-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the Stratix? 10 SX series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 2800K Logic Elements.Housed in the state-of-art Tray package.704 I/Os are included in this SoC part.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX280LU3F50E1VG System On Chip (SoC) applications.

  • USB hard disk enclosure
  • Networked Media Encode/Decode
  • Central alarm system
  • Automated sorting equipment
  • ARM
  • Keywords
  • Cyber security for critical applications in the aerospace
  • Efficient hardware for inference of neural networks
  • Apple smart watch
  • Smart appliances