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  • 72V821L20TF8

72V821L20TF8

3.3V 64 Pin FIFO memory IC12 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V821L20TF8
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 110
  • Description: 3.3V 64 Pin FIFO memory IC12 ns Min 3V VMax 3.6V V(Kg)

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Details

Tags

Parameters
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 64
Published 2008
Part Status Discontinued
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 50MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 50MHz
Access Time 12 ns
Direction Bidirectional
Density 18 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Bidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 10mm
Width 10mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V821L20TF8 Overview


FIFO memory chip is included in the TQFP package.It is pointing in the direction of Surface Mount .As far as the operation pins are concerned, they are 64 pins.In order to operate FIFO design, a maximum current of 40mA is required.When the supply voltage is set to 3.3V , the FIFO's maximum efficiency is achieved.During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.If the supply voltage is very low, such as 3V V, FIFO may be able to operate.There is a maximum supply voltage of 3.6V volts that FIFO memory can handle.It is capable of maintaining good accuracy with a frequency of 50MHz .Regular operation has a FIFO memory's maximum value of 50MHz .

72V821L20TF8 Features


Frequency at most

72V821L20TF8 Applications


There are a lot of Integrated Device Technology (IDT) 72V821L20TF8 FIFOs Memory applications.

  • Tape controllers
  • Digital buffering
  • Multi-stage synchronizer
  • Cameras
  • Data communications
  • Multimedia
  • Network switching/routing
  • Extended product life cycle
  • Test site
  • Wireless