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A2F060M3E-1FGG256I

256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F060M3E-1FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 736
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F060M3E
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 1536 CLBS, 60000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Equivalent Gates 60000
Flash Size 128KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops together.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.Ideally, a power supply with a voltage of 1.5V should be used.In the SoCs wireless, high voltages above 1.575V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.425V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.system on a chip benefits from 256 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 66 outputs available on this SoC.There is a flash of 128KB on it.You can get system on chips with similar specs and purposes by searching A2F060M3E.wireless SoCs operate at 100MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.256 pins are present on this computer SoC.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-1FGG256I System On Chip (SoC) applications.

  • Measurement testers
  • Wireless sensor networks
  • Multiprocessor system-on-chips (MPSoCs)
  • Deep learning hardware
  • Keyboard
  • Networked sensors
  • Mobile market
  • Automated sorting equipment
  • Self-aware system-on-chip (SoC)
  • Networked sensors