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A2F500M3G-1CS288I

288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1CS288I
  • Package: 288-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 530
  • Description: 288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 288-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 288
Terminal Finish TIN LEAD SILVER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
JESD-30 Code S-PBGA-B288
Number of Outputs 78
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 31, FPGA - 78
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Number of Inputs 78
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Height Seated (Max) 1.05mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.This system on a chip is packaged as 288-TFBGA, CSPBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.It comes in a state-of-the-art Tray package.MCU - 31, FPGA - 78 I/Os are included in this SoC part.It is recommended to use a 1.5V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.The system on a chip uses 288 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.It is possible to use this SoC chip with 78 outputs.A power supply of 1.51.82.53.3V is required.A SoC chip with 78 inputs is available to the user.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.The SoC meaning is based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1CS288I System On Chip (SoC) applications.

  • Temperature
  • Medical
  • Efficient hardware for training of neural networks
  • Remote control
  • Test and Measurement
  • Healthcare
  • PC peripherals
  • Industrial robot
  • Automotive gateway
  • Self-aware system-on-chip (SoC)