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ADSP-21061KS-133

CPLD SHARC? Series 240-BFQFP Exposed Pad


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-ADSP-21061KS-133
  • Package: 240-BFQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 200
  • Description: CPLD SHARC? Series 240-BFQFP Exposed Pad (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case 240-BFQFP Exposed Pad
Supplier Device Package 240-MQFP-EP (32x32)
Operating Temperature 0°C~85°C TC
Packaging Tray
Series SHARC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Floating Point
Interface Synchronous Serial Port (SSP)
Voltage - I/O 5.00V
Non-Volatile Memory External
Voltage - Core 5.00V
On Chip Data RAM 128kB
Clock Rate 33MHz
RoHS Status Non-RoHS Compliant
Mounting Type Surface Mount

ADSP-21061KS-133 Overview


It is a kind of electronic component that comes in a package of 240-BFQFP Exposed Pad.Tray packaging is provided for it.The Floating Point family provides a wide range of applications.The mounting is carried out in the direction of Surface Mount.The operation of the device at the temperature of 0°C~85°C TC ensures the normal operation of the device.The analog voltage range of 5.00V refers to the input or output voltage.As part of the SHARC? series, this digital signal processor is included.

ADSP-21061KS-133 Features


Supplied in the 240-BFQFP Exposed Pad package

ADSP-21061KS-133 Applications


There are a lot of Rochester Electronics, LLC ADSP-21061KS-133 DSP applications.

  • Vibration signal processing
  • Digital image processing
  • 3D tomography and imaging processing
  • Digital camera
  • Other sensor array processing
  • Instrument modeling
  • Dam design
  • Seismology
  • Speech signal processing
  • Scene analysis technology