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  • LFSCM3GA115EP1-6FC1152C

LFSCM3GA115EP1-6FC1152C

5.2mm mm FPGAs SCM Series 1152-BCBGA, FCBGA 1mm mm


  • Manufacturer: Lattice Semiconductor Corporation
  • Origchip NO: 477-LFSCM3GA115EP1-6FC1152C
  • Package: 1152-BCBGA, FCBGA
  • Datasheet: PDF
  • Stock: 215
  • Description: 5.2mm mm FPGAs SCM Series 1152-BCBGA, FCBGA 1mm mm (Kg)

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Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1152-BCBGA, FCBGA
Number of Pins 1152
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2010
Series SCM
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.95V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFSCM3GA115
Number of Outputs 660
Power Supplies 1.21.2/3.32.5V
Number of I/O 660
RAM Size 954kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 115000
Total RAM Bits 7987200
Max Frequency 700MHz
Number of LABs/CLBs 28750
Number of CLBs 424
Height Seated (Max) 5.2mm
Length 35mm
Width 35mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Lead Free

LFSCM3GA115EP1-6FC1152C Overview


A 1152-BCBGA, FCBGA package is provided with this component. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Its 660 I/Os help it transfer data more efficiently. There are 115000 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.95V~1.26V battery. The SCM series FPGA is a type of FPGA that belongs to the SCM family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. The device has 660 outputs that are integrated into it. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 7987200 bFpga chipss. In order to find related parts, you can use its base part number LFSCM3GA115. This FPGA module has a RAM si954kBe of 954kB that is sufficient to make sure that the program is able to run normally. In order to make it work, 1152 pins have been designed. 28750 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. Its architecture is based on 424 CLBs. In fact, this FPGA is capable of reaching a speed of 700MHz.

LFSCM3GA115EP1-6FC1152C Features


660 I/Os
Up to 7987200 RAM bits
1152 LABs/CLBs

LFSCM3GA115EP1-6FC1152C Applications


There are a lot of Lattice Semiconductor Corporation LFSCM3GA115EP1-6FC1152C FPGAs applications.

  • Aerospace and Defense
  • Audio
  • Military DSP
  • Digital signal processing
  • Scientific Instruments
  • Automotive advanced driver assistance systems (ADAS)
  • Data center hardware accelerators
  • Automotive Applications
  • Medical imaging
  • Industrial IoT