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M2S010-VF256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010-VF256I
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 618
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 2 days ago)
Package / Case 256-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.This system on a chip is packaged as 256-LFBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 138 I/Os.It is advised to utilize a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.In total, there are 256 terminations, so system on a chip is really aided by this.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 138 outputs.This system on chip SoC requires 1.2V power supply at all.138 inputs are available on the SoC chip.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010-VF256I System On Chip (SoC) applications.

  • Functional safety for critical applications in the aerospace
  • Flow Sensors
  • CNC control
  • Automated sorting equipment
  • Medical
  • Measurement tools
  • Keywords
  • AC-input BLDC motor drive
  • Deep learning hardware
  • Temperature