All Products

M2S010T-1FGG484I

-40°C~100°C TJ 484 Pin M2S010T System On ChipSmartFusion?2 Series 233 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010T-1FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 405
  • Description: -40°C~100°C TJ 484 Pin M2S010T System On ChipSmartFusion?2 Series 233 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Number of Pins 484
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S010T
Operating Supply Voltage 1.2V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 233
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Speed Grade 1
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 484-BGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.233 I/Os are included in this SoC part.It has a 256KB flash.Search M2S010T for system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.There are a number of features to this SoC meaning which are based on the core architecture of ARM.In this computer SoC, there are 484 pins.Just -40°C is needed to get the SoC computing up and running.100°C is the designing maximum operating temperature of this SoC system on chip.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S010T-1FGG484I System On Chip (SoC) applications.

  • Industrial transport
  • Embedded systems
  • Mobile market
  • Print Special Issue Flyer
  • Central alarm system
  • CNC control
  • External USB hard disk/SSD
  • Special Issue Information
  • Communication interfaces ( I2C, SPI )
  • Video Imaging