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M2S025TS-1FG484

0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S025TS-1FG484
Package: 484-BGA
Datasheet: PDF
Stock: 731
Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 2 weeks ago)
Package / Case	484-BGA
Supplier Device Package	484-FPBGA (23x23)
Operating Temperature	0°C~85°C TJ
Packaging	Tray
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	267
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 25K Logic Modules
Flash Size	256KB
RoHS Status	Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 484-BGA.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 267.A flashing 256KB appears on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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