M2S090TS-FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 425 inputs and outputs.Use a power supply with a voltage of 1.2V if possible.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 1.14V are required.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, so system on a chip is really aided by this.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 425 outputs.This system on chip SoC requires 1.2V power supply at all.There are 425 inputs available on the SoC chip.There are 86316 logic cells in the logic system on chips.The flash size of the SoC meaning is 512KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation

M2S090TS-FGG676I System On Chip (SoC) applications.

• ARM processors
• Digital Media
• Functional safety for critical applications in the aerospace
• ARM support modules
• Central alarm system
• Body control module
• Temperature Sensors
• Transmitters
• ARM
• Keywords