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MC32PF1510A5EP

3.8V~7V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC32PF1510A5EP
  • Package: 40-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 623
  • Description: 3.8V~7V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 40-VFQFN Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply 3.8V~7V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant

MC32PF1510A5EP Overview


The way of Tray is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 40-VFQFN Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.Among other applications, this power management targets Embedded Systems, Low-Power IoT, Mobile/Wearable Devices .A temperature setting of -40°C~85°C is recommended to avoid malfunctions.3.8V~7V voltage is used for the operation of this power management.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received much praise.

MC32PF1510A5EP Features


Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC32PF1510A5EP Applications


There are a lot of NXP USA Inc. MC32PF1510A5EPPower Management applications.

  • SSTL-2 Termination
  • Automotive Infotainment
  • Optical imaging payload
  • Equipment Run-Off of Battery Backup
  • FPGA, DSP Core Power
  • Automotive camera module
  • Automotive Infotainment
  • Environmental Test
  • Automotive cluster
  • Docking station