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STAC9200X5TAEB1X

STAC9200X5TAEB1X datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-STAC9200X5TAEB1X
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 368
  • Description: STAC9200X5TAEB1X datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case TQFP
Number of Pins 48
Published 2004
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Type General Purpose
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Operating Supply Voltage 3.3V
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Nominal Supply Current 50mA
Resolution 3 B
Sampling Rate 192 ksps
Number of A/D Converters 2
Signal to Noise Ratio (SNR) 100 dB
Length 7mm
Width 7mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

STAC9200X5TAEB1X Overview


A TQFP package is provided to save space. The high-efficiency performance of this electronic part can be achieved in various applications due to its type of General Purpose. There are 48 pins on this device. Using the Surface Mount technology, it is mounted to a PCB. It is recommended to maintain the maximum supply voltage at 3.465V. To convert analog signals into digital signals, there are 2 A/D converters. Supply voltage should be maintained at 3.135V. Operating voltage of 3.3V is possible. In order to maintain normal use, the operating temperature is set to 70°C. The operating temperature is set with the minimum value of 0°C to keep normal use. There is normally a current of 50mA flowing through the circuit at any given time.

STAC9200X5TAEB1X Features


Embedded in the TQFP package
2 A/D converters

STAC9200X5TAEB1X Applications


There are a lot of Integrated Device Technology (IDT) STAC9200X5TAEB1X CODECs Interface ICs applications.

  • Galvanometer scanners
  • Servo motors
  • Linear measurement
  • Steel mills
  • RF-based home automation system
  • High-performance memory systems
  • Addition
  • Dynamic applications
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  • Packaging