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  • TMS320C25FNL50

TMS320C25FNL50

CPLD TMS320C2x Series 68-LCC (J-Lead)


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TMS320C25FNL50
  • Package: 68-LCC (J-Lead)
  • Datasheet: PDF
  • Stock: 916
  • Description: CPLD TMS320C2x Series 68-LCC (J-Lead) (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 68-LCC (J-Lead)
Supplier Device Package 68-PLCC (24.23x24.23)
Operating Temperature 0°C~70°C TA
Packaging Tube
Series TMS320C2x
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Interface Serial Port
Voltage - I/O 5.00V
Non-Volatile Memory ROM (8kB)
Voltage - Core 5.00V
On Chip Data RAM 1kB
Clock Rate 50MHz
RoHS Status ROHS3 Compliant

TMS320C25FNL50 Overview


This is an electronic component with a 68-LCC (J-Lead) package.Tube is the packaging method provided.The fact that it belongs to the Fixed Point family means that it can be applied to a wide range of applications.The device is attached in a way that faces Surface Mount.It is essential that 0°C~70°C TA is kept at a temperature that ensures proper operation of the machine.This refers to the analog voltage range that can be input or output from 5.00V.As part of the TMS320C2x series, this digital signal processor is included.

TMS320C25FNL50 Features


Supplied in the 68-LCC (J-Lead) package

TMS320C25FNL50 Applications


There are a lot of Rochester Electronics, LLC TMS320C25FNL50 DSP applications.

  • Medical imaging
  • Audio synthesis
  • Other sensor array processing
  • Fourier transform
  • Spectral density estimation
  • Smart phones
  • Speech processing
  • 3D tomography and imaging processing
  • Instrument modeling
  • Geoscience signal processing