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XC7Z010-3CLG400E

400 Terminations0°C~100°C TJ 400 Pin XC7Z010 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z010-3CLG400E
  • Package: 400-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 864
  • Description: 400 Terminations0°C~100°C TJ 400 Pin XC7Z010 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 400-LFBGA, CSPBGA
Surface Mount YES
Number of Pins 400
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 866MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z010
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -3
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 1.6mm
Length 17mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 400-LFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 28K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.Having 400 terminations in total makes system on a chip possible.By searching XC7Z010, you can find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 866MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.This is the version with 400 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z010-3CLG400E System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Cyber security for critical applications in the aerospace
  • ARM Cortex M4 microcontroller
  • USB hard disk enclosure
  • Digital Signal Processing
  • Wireless networking
  • Communication network-on-Chip (cNoC)
  • Avionics
  • Vending machines
  • Sports