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XC7Z030-3FBG484E

484 Terminations0°C~100°C TJ 484 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-3FBG484E
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 127
  • Description: 484 Terminations0°C~100°C TJ 484 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Number of Pins 484
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 1GHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -3
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 23mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Its package is 484-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.For the SoCs wireless, a voltage higher than 1.05V is considered unsafe.Having 484 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z030.In this wireless SoC, the frequency is set to 1GHz.The SoC meaning is based on the core architecture of ARM.This is the version with 484 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-3FBG484E System On Chip (SoC) applications.

  • sequence controllers
  • Keyboard
  • Industrial sectors
  • Automotive gateway
  • Robotics
  • Video Imaging
  • RISC-V
  • Flow Sensors
  • Communication interfaces ( I2C, SPI )
  • POS Terminals