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XC7Z045-1FBG676C

676 Terminations0°C~85°C TJ 676 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V Min 1.2V VMax 3.3V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-1FBG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 997
  • Description: 676 Terminations0°C~85°C TJ 676 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V Min 1.2V VMax 3.3V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 3.3V
Min Supply Voltage 1.2V
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Number of Logic Elements/Cells 190000
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.It is really beneficial to have system on a chip since there are 676 terminations in total.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In terms of core architecture, the SoC meaning relies on ARM.This is the 676-pin version of the computer SoC.Voltage of maximum supply is 3.3V.A minimum of 1.2V are supplied to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-1FBG676C System On Chip (SoC) applications.

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