XC7Z045-2FBG676E

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.It comes in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.Search XC7Z045 for system on chips with similar specs and purposes.800MHz is the wireless SoC's frequency.In this SoC meaning, ARM serves as the core architecture.It is just enough to start the SoC computing at 0°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-2FBG676E System On Chip (SoC) applications.

• System-on-chip (SoC)
• Robotics
• Medical Pressure
• Cyber security for critical applications in the aerospace
• Optical drive
• Healthcare
• Vending machines
• Functional safety for critical applications in the aerospace
• Medical
• Industrial transport