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XC7Z100-2FFG900I

900 Terminations-40°C~100°C TJ 900 Pin XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z100-2FFG900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 316
  • Description: 900 Terminations-40°C~100°C TJ 900 Pin XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 900-BBGA, FCBGA
Number of Pins 900
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z100
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 212
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part has a total of 212 I/Os.It is recommended to use a 1V power supply.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 0.95V can be supplied as a power source.Having 900 terminations in total makes system on a chip possible.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.There is 800MHz frequency associated with the wireless SoC.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC has a pin count of 900.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z100-2FFG900I System On Chip (SoC) applications.

  • High-end PLC
  • Industrial automation devices
  • Wireless sensor networks
  • Samsung galaxy gear
  • CNC control
  • Industrial sectors
  • Medical
  • Industrial
  • Robotics
  • Video Imaging