All Products

XCZU3CG-1SBVA484E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3CG-1SBVA484E
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 201
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 484-BFBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 82
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 484-BFBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 82 I/Os.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU3CG-1SBVA484E System On Chip (SoC) applications.

  • Temperature
  • Healthcare
  • Defense
  • Mobile computing
  • Special Issue Information
  • Samsung galaxy gear
  • Special Issue Editors
  • Industrial Pressure
  • Industrial automation devices
  • Vending machines