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10AS032E3F29E2LG

780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V


  • Manufacturer: Intel
  • Origchip NO: 386-10AS032E3F29E2LG
  • Package: 780-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 399
  • Description: 780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B780
Number of Outputs 360
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.9V
Supply Voltage-Min (Vsup) 0.87V
Number of I/O 360
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 320K Logic Elements
Number of Logic Cells 320000
Height Seated (Max) 3.35mm
Length 29mm
Width 29mm
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 780-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Arria 10 SX series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 320K Logic Elements.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 360 inputs and outputs.A 0.9V power supply should be used.There is no safe voltage for the SoCs wireless above 0.93V.In order to run it, it must be fed by at least 0.87V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 780 terminations in total, which does really benefit system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 360 outputs.There is 0.9V power supply required for system on chip.There are 360 inputs available on the SoC chip.320000 logic cells are present in logic system on chips.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS032E3F29E2LG System On Chip (SoC) applications.

  • Automated sorting equipment
  • POS Terminals
  • Networked sensors
  • Functional safety for critical applications in the aerospace
  • Apple smart watch
  • Automotive gateway
  • Self-aware system-on-chip (SoC)
  • ARM processors
  • Industrial Pressure
  • Mobile market