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Thermal Management

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Analog Devices Inc.
TO-100-10 Metal Can Thermal Management 9.4mm mmContains Lead
237
TO-100-10 Metal Can
Nuvoton Technology Corporation of America
SC-74A, SOT-753 Thermal Management
816
SC-74A, SOT-753
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V VLead Free
484
16-SSOP (0.154, 3.90mm Width)
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
368
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Nuvoton Technology Corporation of America
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
940
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Microchip Technology
8-UFDFN Exposed Pad Thermal Management
693
8-UFDFN Exposed Pad
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V7.8mm mmContains Lead
859
24-TSSOP (0.173, 4.40mm Width)
Linear Technology/Analog Devices
20-WFQFN Exposed Pad Thermal Management
361
20-WFQFN Exposed Pad
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
792
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Texas Instruments
24-WFQFN Exposed Pad Thermal Management 3.3V V5mm mmLead Free
130
24-WFQFN Exposed Pad
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
737
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
247
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Nuvoton Technology Corporation of America
16-WQFN Exposed Pad Thermal Management
682
16-WQFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management
768
8-WFDFN Exposed Pad
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V VLead Free
894
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Texas Instruments
8-SOIC (0.154, 3.90mm Width) Thermal Management 3.3V V4.9mm mmLead Free
357
8-SOIC (0.154, 3.90mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V
627
16-SSOP (0.154, 3.90mm Width)
Microchip Technology
20-VFQFN Exposed Pad Thermal Management 4mm mm
740
20-VFQFN Exposed Pad
Analog Devices Inc.
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
818
14-CDIP (0.300, 7.62mm)
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
899
16-SSOP (0.154, 3.90mm Width)
Rochester Electronics, LLC
16-SSOP (0.154, 3.90mm Width) Thermal Management
817
16-SSOP (0.154, 3.90mm Width)
Texas Instruments
14-SOIC (0.154, 3.90mm Width) Thermal Management 8.65mm mmLead Free
843
14-SOIC (0.154, 3.90mm Width)
Texas Instruments
8-SOIC (0.154, 3.90mm Width) Thermal Management 3.3V V4.9mm mmContains Lead
305
8-SOIC (0.154, 3.90mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.89mm mmLead Free
756
16-SSOP (0.154, 3.90mm Width)
Nuvoton Technology Corporation of America
48-LQFP Thermal Management 7mm mm
464
48-LQFP
Texas Instruments
16-SOIC (0.154, 3.90mm Width) Thermal Management 9.9mm mmLead Free
470
16-SOIC (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management Contains Lead
393
24-TSSOP (0.173, 4.40mm Width)
Maxim Integrated
Thermal Management 3.6V V
634
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Linear Technology/Analog Devices
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mm
947
8-SOIC (0.154, 3.90mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V VContains Lead
379
16-SSOP (0.154, 3.90mm Width)