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10AS066H3F34I3SGES

-40°C~100°C TJ System On ChipArria 10 SX Series 492 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-10AS066H3F34I3SGES
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 326
  • Description: -40°C~100°C TJ System On ChipArria 10 SX Series 492 I/O(Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA, FC (35x35)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 492
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 660K Logic Elements

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Arria 10 SX series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 660K Logic Elements and that is something to note.An advanced Tray package houses this SoC system on a chip.492 I/Os are available in this SoC part.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

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