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1SX280LU3F50I3XG

-40°C~100°C TJ System On ChipStratix? 10 SX Series


  • Manufacturer: Intel
  • Origchip NO: 386-1SX280LU3F50I3XG
  • Package: 2397-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 154
  • Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series (Kg)

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Details

Tags

Parameters
Package / Case 2397-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Reach Compliance Code compliant
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2800K Logic Elements
Factory Lead Time 8 Weeks

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, this SoC is built.This system on a chip is packaged as 2397-BBGA, FCBGA by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Stratix? 10 SX series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines FPGA - 2800K Logic Elements and that is something to note.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX280LU3F50I3XG System On Chip (SoC) applications.

  • Cyber security for critical applications in the aerospace
  • USB hard disk enclosure
  • Three phase UPS
  • Microcontroller based SoC ( RISC-V, ARM)
  • Temperature
  • Medical
  • Print Special Issue Flyer
  • Networked sensors
  • High-end PLC
  • Networked Media Encode/Decode