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3462-0001

3462-0001 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at Utmel


  • Manufacturer: 3M
  • Origchip NO: 2-3462-0001
  • Package: -
  • Datasheet: PDF
  • Stock: 490
  • Description: 3462-0001 datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at Utmel(Kg)

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Details

Tags

Parameters
Factory Lead Time 5 Weeks
Contact Material Copper Alloy
Contact Plating Gold
Mount Flanges, Free Hanging, Panel
Mounting Type Free Hanging (In-Line)
Housing Material Polybutylene
Weight 1.451496kg
Material - Insulation Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C~105°C
Packaging Bulk
Published 2005
Series 3000
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination IDC
Number of Positions 26
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Color Gray
Number of Rows 2
Gender Female
Pitch 0.100 2.54mm
Orientation Right Angle
Depth 11.2mm
Current Rating 1A
Contact Finish Gold
Approval Agency UL
Lead Pitch 2.54mm
Number of Contacts 26
Housing Color Grey
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 13
Max Current Rating 1A
Length 45mm
Width 24.4mm
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.054 ~ 0.070 1.37mm ~ 1.78mm
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free

3462-0001 Overview


As per Bulk's specifications, the material was packaged.It is recommended to mount the device using mounting type Free Hanging (In-Line).It indicates the series of the device by the 3000.Stable operation requires 105°C°C as the max operating temperature.A minimum working temperature of -55°C degrees Celsius is required to ensure its reliability.

3462-0001 Features


3000 series

3462-0001 Applications


There are a lot of 3M 3462-0001 Edgeboard Connectors applications.

  • Smart antenna systems
  • Transducer
  • Digital Storage Oscilloscope
  • Multiplexed Data Acquisition Systems
  • Medical Instrumentation and medical imaging
  • Micro and pico cell systems, software radios
  • Communication Systems
  • High Speed Data Acquisition
  • RADAR processing, digital oscilloscopes
  • Digital beam-forming systems for ultrasound