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72201L10JG

5V 32 Pin FIFO memory IC6.5 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72201L10JG
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 724
  • Description: 5V 32 Pin FIFO memory IC6.5 ns Min 4.5V VMax 5.5V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 32
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 100MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 35mA
Max Supply Current 35mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Direction Unidirectional
Density 2.3 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 13.97mm
Width 11.43mm
Thickness 2.79mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72201L10JG Overview


FIFO memory chip is included in the PLCC package.The recommended mounting method for this FIFO products is Surface Mount .32 pins are the operation pins.In order for FIFO design to operate, a maximum current of 35mA is required.When setting the supply voltage to 5V , you will achieve FIFO's maximum efficiency.During operation, a minimum temperature of 0°C degrees Celsius should be maintained in order to ensure reliability.A memory logic's maximum operating temperature of 70°C degrees Celsius assures stable operation.Typically, FIFO would work at 4.5V volts, but it may also work at higher voltages.FIFO memory is capable of handling a maximum supply voltage of 5.5V volts.When the frequency is set to 100MHz , the system can maintain good accuracy.Regular operation has a FIFO memory's maximum value of 100MHz .

72201L10JG Features


Frequency at most

72201L10JG Applications


There are a lot of Integrated Device Technology (IDT) 72201L10JG FIFOs Memory applications.

  • Game Controller
  • TVs
  • General Data Collection Applications at Extreme High-Temperatures
  • Computers
  • Controlled baseline
  • A/D output buffers
  • Down-Hole Energy Drilling
  • Industrial Systems
  • Portable Information Devices
  • Thermal Management for DDR3 Memory Modules