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  • 72225LB10J8

72225LB10J8

5V 68 Pin FIFO memory IC6.5 ns Min 4.5V VMax 5.5V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72225LB10J8
  • Package: PLCC
  • Datasheet: PDF
  • Stock: 415
  • Description: 5V 68 Pin FIFO memory IC6.5 ns Min 4.5V VMax 5.5V V(Kg)

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Details

Tags

Parameters
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case PLCC
Number of Pins 68
Published 2000
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 100MHz
Operating Supply Voltage 5V
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Element Configuration Dual
Nominal Supply Current 60mA
Max Supply Current 60mA
Frequency (Max) 100MHz
Access Time 6.5 ns
Direction Unidirectional
Density 18 kb
Sync/Async Synchronous
Word Size 18b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 24mm
Width 24mm
Thickness 3.63mm
RoHS Status RoHS Compliant
Lead Free Contains Lead
Factory Lead Time 7 Weeks

72225LB10J8 Overview


This package is included in PLCC .It is recommended that memory IC be mounted in the Surface Mount direction.68 pins are used for operation.For its operation, 60mA is the maximum current required.In order to maximize efficiency, the supply voltage should be set to 5V .FIFO operates at a minimum temperature of 0°C degrees Celsius to ensure reliabilFIFOy.By using a memory logic's maximum operating temperature of 70°C degrees Celsius, stable operation can be achieved.FIFO may operate at very low supply voltages, such as 4.5V volts.FIFO memory can handle a maximum supply voltage of 5.5V V.It is capable of maintaining good accuracy with a frequency of 100MHz .During regular operation, 100MHz is the FIFO memory's maximum value.

72225LB10J8 Features


Frequency at most

72225LB10J8 Applications


There are a lot of Integrated Device Technology (IDT) 72225LB10J8 FIFOs Memory applications.

  • Address mapping
  • MP3 Interface for Automobile
  • SPI Bus Flash Memory Device
  • Controlled baseline
  • Signal processing
  • Network bridges
  • SPI Bus Flash Memory Devices
  • Thermal Management for DDR3 Memory Modules
  • General Data Collection Applications at Extreme High-Temperatures
  • Temporary storage elements