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  • 72V201L15PFGI8

72V201L15PFGI8

3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V201L15PFGI8
  • Package: LQFP
  • Datasheet: PDF
  • Stock: 183
  • Description: 3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case LQFP
Number of Pins 32
Published 2008
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Frequency 66.7MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 20mA
Max Supply Current 20mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Direction Unidirectional
Density 2.3 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 7mm
Width 7mm
Thickness 1.4mm
RoHS Status RoHS Compliant
Lead Free Lead Free

72V201L15PFGI8 Overview


You will find FIFO memory chip in the LQFP package.Mounting it in Surface Mount is recommended.Operation pins are 32 .For its operation, 20mA is the maximum current required.When setting the supply voltage to 3.3V , you will achieve FIFO's maximum efficiency.It is designed to run at a minimum temperature of -40°C degrees Celsius to ensure reliability.By using a memory logic's maximum operating temperature of 85°C degrees Celsius, stable operation can be achieved.If the supply voltage is very low, such as 3V V, FIFO may be able to operate.A maximum supply voltage of 3.6V V can be handled by this FIFO memory chip.In the presence of a 66.7MHz frequency, it can maintain good accuracy.During regular operation, the FIFO memory's maximum value is 66.7MHz .

72V201L15PFGI8 Features


Frequency at most

72V201L15PFGI8 Applications


There are a lot of Integrated Device Technology (IDT) 72V201L15PFGI8 FIFOs Memory applications.

  • SPI Bus Flash Memory Device
  • Desktop Computers
  • Product traceability
  • Cardiac Monitoring Device
  • Rate buffers
  • Thermal Management for DDR3 Memory Modules
  • Data communications
  • Wireless
  • Portable Information Devices
  • Queues for communication systems