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72V221L15PFG

3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V221L15PFG
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 477
  • Description: 3.3V 32 Pin FIFO memory IC10 ns Min 3V VMax 3.6V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Tin
Mount Surface Mount
Package / Case TQFP
Number of Pins 32
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 66.7MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Element Configuration Dual
Nominal Supply Current 20mA
Max Supply Current 20mA
Frequency (Max) 66.7MHz
Access Time 10 ns
Direction Unidirectional
Density 9 kb
Sync/Async Synchronous
Word Size 9b
Bus Directional Unidirectional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
Length 7mm
Width 7mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

72V221L15PFG Overview


You will find FIFO memory chip in the TQFP package.Memory IC's recommended mounted way is Surface Mount .These are the 32 pins for operation.In order for FIFO design to operate, FIFO design requires a maximum current of 20mA .The supply voltage should be set to 3.3V in order to achieve FIFO's maximum efficiency.For reliability, FIFO works at a minimum temperature of 0°C degrees Celsius.By operating at a temperature of 70°C °C, the FIFO products is capable of stable operation.Low supply voltages, such as 3V V, may be required for operation.An input voltage of 3.6V V is the maximum that FIFO memory can handle.In the presence of a 66.7MHz frequency, it can maintain good accuracy.For regular operation, the memory logic's maximum value is 66.7MHz .

72V221L15PFG Features


Frequency at most

72V221L15PFG Applications


There are a lot of Integrated Device Technology (IDT) 72V221L15PFG FIFOs Memory applications.

  • Magnetic memories
  • Alarm System
  • Consumer Systems
  • General Data Collection Applications at Low-Temperatures
  • Data-acquisition systems
  • IP Radio
  • Emulators
  • Thermal Management for DDR3 Memory Modules
  • Consumer
  • Analog-to-digital converters