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  • 72V3660L6BB8

72V3660L6BB8

3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-72V3660L6BB8
  • Package: BGA
  • Datasheet: PDF
  • Stock: 513
  • Description: 3.3V 144 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Contact Plating Lead, Tin
Mount Surface Mount
Package / Case BGA
Number of Pins 144
Published 2008
Part Status Active
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Frequency 166MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.45V
Min Supply Voltage 3.15V
Element Configuration Dual
Nominal Supply Current 40mA
Max Supply Current 40mA
Frequency (Max) 166MHz
Access Time 4 ns
Density 144 kb
Sync/Async Synchronous
Word Size 36b
Bus Directional Unidirectional
Retransmit Capability Yes
Length 13mm
Width 13mm
Thickness 1.76mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

72V3660L6BB8 Overview


FIFO memory chip is included in the BGA package.It is pointing in the direction of Surface Mount .There are 144 pins on the operation pins.FIFO design requires a maximum current of 40mA to operate.When setting the supply voltage to 3.3V , you will achieve FIFO's maximum efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of 0°C degrees Celsius.The stable operation is enabled by the memory logic's maximum operating temperature of 70°C °C.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.This FIFO memory chip can handle maximum supply voltages of 3.45V volts.It maintains good accuracy at a 166MHz frequency.During regular operation, 166MHz is the FIFO memory's maximum value.

72V3660L6BB8 Features


Frequency at most

72V3660L6BB8 Applications


There are a lot of Integrated Device Technology (IDT) 72V3660L6BB8 FIFOs Memory applications.

  • Video time base correction
  • One assembly
  • General Data Collection Applications at Low-Temperatures
  • Alarm System
  • IP Radio
  • Computer Systems
  • Networking
  • Test Equipment
  • Thermal Management for DDR3 Memory Modules
  • Data-acquisition systems