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74LCX374FT(AE)

2V~3.6V 150MHz D-Type Flip Flop 10μA 74LCX Series 20-TSSOP (0.173, 4.40mm Width)

Manufacturer: Toshiba Semiconductor and Storage
Origchip NO: 830-74LCX374FT(AE)
Package: 20-TSSOP (0.173, 4.40mm Width)
Datasheet: PDF
Stock: 481
Description: 2V~3.6V 150MHz D-Type Flip Flop 10μA 74LCX Series 20-TSSOP (0.173, 4.40mm Width)(Kg)

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Details

Tags

Parameters
Factory Lead Time	16 Weeks
Mounting Type	Surface Mount
Package / Case	20-TSSOP (0.173, 4.40mm Width)
Operating Temperature	-40°C~85°C TA
Packaging	Tape & Reel (TR)
Published	2014
Series	74LCX
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	D-Type
Voltage - Supply	2V~3.6V
Function	Standard
Output Type	Tri-State, Non-Inverted
Number of Elements	1
Clock Frequency	150MHz
Current - Quiescent (Iq)	10μA
Current - Output High, Low	24mA 24mA
Number of Bits per Element	8
Max Propagation Delay @ V, Max CL	8.5ns @ 3.3V, 50pF
Trigger Type	Positive Edge
Input Capacitance	7pF
RoHS Status	RoHS Compliant
Lead Free	Lead Free

74LCX374FT(AE) Overview

The package is in the form of 20-TSSOP (0.173, 4.40mm Width). A package named Tape & Reel (TR)includes it. There is a Tri-State, Non-Invertedoutput configured with it. The trigger configured with it uses Positive Edge. This electronic part is mounted in the way of Surface Mount. A supply voltage of 2V~3.6V is required for operation. In this case, the operating temperature is -40°C~85°C TA. This electronic flip flop is of type D-Type. In FPGA terms, D flip flop is a type of 74LCXseries FPGA. It should not exceed 150MHzin its output frequency. In total, it contains 1 elements. As a result, it consumes 10μA of quiescent current without being affected by external factors. There is 7pF input capacitance for this T flip flop.

74LCX374FT(AE) Features

Tape & Reel (TR) package
74LCX series

74LCX374FT(AE) Applications

There are a lot of Toshiba Semiconductor and Storage 74LCX374FT(AE) Flip Flops applications.

Guaranteed simultaneous switching noise level
Parallel data storage
Individual Asynchronous Resets
Differential Individual
Communications
CMOS Process
Storage Registers
Frequency Dividers
Load Control
ESD performance