English

All Products

View All >>
  • 74LVC1G126FS3-7

74LVC1G126FS3-7

74LVC1G126FS3-7 datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Diodes Incorporated stock available at Utmel


  • Manufacturer: Diodes Incorporated
  • Origchip NO: 233-74LVC1G126FS3-7
  • Package: 4-UFDFN Exposed Pad
  • Datasheet: PDF
  • Stock: 397
  • Description: 74LVC1G126FS3-7 datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Diodes Incorporated stock available at Utmel(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 19 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 4-UFDFN Exposed Pad
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2011
Series 74LVC
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Technology CMOS
Voltage - Supply 1.65V~5.5V
Terminal Position DUAL
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.48mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 74LVC1G126
JESD-30 Code S-PDSO-N4
Output Type 3-State
Supply Voltage-Max (Vsup) 5.5V
Operating Supply Current 100nA
Number of Ports 2
Number of Bits 1
Propagation Delay 3 ns
Family LVC/LCX/Z
Logic Function Buffer, Inverting
Current - Output High, Low 32mA 32mA
Logic Type Buffer, Non-Inverting
Output Polarity TRUE
Number of Input Lines 1
Height Seated (Max) 0.35mm
Length 0.8mm
Width 0.8mm
RoHS Status ROHS3 Compliant

74LVC1G126FS3-7 Overview


Logical driver uses a neat 4-UFDFN Exposed Pad package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 1.65V~5.5V. Qualified to operate within -40°C~125°C TA. The high and low logic state output current of logical driver is 32mA 32mA. Logical driver can deal with 3-State output (s). Digital buffer is one of the 74LVC series devices. 4 terminations with different functions. Buffer IC reuqires a supply voltage of 1.8V. This logical driver is a member of the LVC/LCX/Z family. Buffer IC is suitable for Surface Mount applications. Enhanced with 2 ports. You can search "74LVC1G126" for other related electrical components. 1 bits are included within the electrical component. Because of its 1 lines level input capability, buffer IC is more cost-effective on transimitting signals. Bus transceiver operates on 100nA.

74LVC1G126FS3-7 Features



74LVC1G126FS3-7 Applications


There are a lot of Diodes Incorporated 74LVC1G126FS3-7 Buffers & Transceivers applications.

  • IP cameras
  • Indoor ad hoc meeting
  • Data center
  • Shortwave receiver
  • Wired telephone
  • Fiber distributed data interface (FDDI)
  • Wireless access points
  • Car alarm systems
  • Optical sub-assembly (OSA)
  • WDM transmission