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92HD88B3X5NDGXRAX8

92HD88B3X5NDGXRAX8 datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-92HD88B3X5NDGXRAX8
  • Package: QFN
  • Datasheet: -
  • Stock: 379
  • Description: 92HD88B3X5NDGXRAX8 datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Package / Case QFN
Surface Mount YES
Number of Pins 40
Packaging Tape & Reel
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Number of Terminations 40
Terminal Finish Matte Tin (Sn) - annealed
Additional Feature ALSO REQUIRES 3.135 TO 3.465 V
Terminal Position QUAD
Number of Functions 1
Terminal Pitch 0.4mm
Operating Temperature (Max) 70°C
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75V
Sampling Rate 192 ksps
Number of A/D Converters 2
Consumer IC Type CONSUMER CIRCUIT
Height Seated (Max) 0.9mm
Length 5mm
Width 5mm
Thickness 900μm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

92HD88B3X5NDGXRAX8 Overview


In order to save space, it is packaged in the QFN package. As a packaging method, Tape & Reel is adopted. Signals are prevented from reflecting off the end of transmission lines by 40 terminations. This is a 40-pin electronic device. To convert analog signals into digital signals, there are 2 A/D converters. Voltages below 4.75V are supported by it. The maximum operating temperature shouldnot be in excess of 70°C. This device uses the consumer IC type CONSUMER CIRCUIT. ALSO REQUIRES 3.135 TO 3.465 V is a property of this type.

92HD88B3X5NDGXRAX8 Features


Embedded in the QFN package
2 A/D converters
ALSO REQUIRES 3.135 TO 3.465 V

92HD88B3X5NDGXRAX8 Applications


There are a lot of Integrated Device Technology (IDT) 92HD88B3X5NDGXRAX8 CODECs Interface ICs applications.

  • Material handling
  • Packaging
  • Medical & Lab Equipment
  • Image search
  • Dynamic applications
  • Cut-to-length
  • Rotating radar platforms
  • Demultiplexing
  • Textiles
  • Dimensionality reduction