A2F060M3E-FG256

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is used to build this SoC.Package 256-LBGA is assigned to this system on a chip by the manufacturer.A 16KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is part of the SmartFusion? series of system on a chips.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops, an important feature to keep in mind.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part includes MCU - 26, FPGA - 66 I/Os.It has a 128KB flash.A search for A2F060M3E will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC has 256 pins.Just 0°C will start the SoC computing.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.It is rated with 1.575V maximum supply voltage.It is supplied with at least 1.425V power.

ARM? Cortex?-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-FG256 System On Chip (SoC) applications.

• POS Terminals
• Published Paper
• Industrial automation devices
• Microprocessors
• Apple smart watch
• USB hard disk enclosure
• High-end PLC
• Industrial robot
• Networked Media Encode/Decode
• Keyboard