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A2F200M3F-1CS288I

288 Terminations-40°C~100°C TJ A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-1CS288I
  • Package: 288-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 388
  • Description: 288 Terminations-40°C~100°C TJ A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 288-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 288
Terminal Finish TIN LEAD SILVER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
JESD-30 Code S-PBGA-B288
Number of Outputs 78
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 31, FPGA - 78
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Number of Inputs 78
Organization 4608 CLBS, 200000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Equivalent Gates 200000
Flash Size 256KB
Height Seated (Max) 1.05mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.The manufacturer assigns this system on a chip with a 288-TFBGA, CSPBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part is comprised of MCU - 31, FPGA - 78 inputs and outputs.A 1.5V power supply should be used.In the SoCs wireless, voltages above 1.575V are considered unsafe.Power supplies of at least 1.425V are required.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.In total, there are 288 terminations, which makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 78 outputs.A power supply of 1.51.82.53.3V is required to run system on chip.The SoC chip offers 78 inputs.There is a flash of 256KB.By searching A2F200, you can find system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 100MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1CS288I System On Chip (SoC) applications.

  • Robotics
  • Avionics
  • Communication interfaces ( I2C, SPI )
  • Digital Signal Processing
  • Wireless sensor networks
  • Wireless networking
  • Networked sensors
  • Three phase UPS
  • Functional safety for critical applications in the automotive
  • Servo drive control module