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A2F200M3F-FG256

256 Terminations0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-FG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 463
  • Description: 256 Terminations0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2012
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN LEAD/TIN LEAD SILVER
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 66
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion? series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.There is a state-of-the-art Tray package that houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.It is really beneficial to have system on a chip since there are 256 terminations in total.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 66 outputs available on this SoC.This flash has a size of 256KB.You can get system on chips with similar specs and purposes by searching A2F200.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is available in 256-pin form.A maximum supply voltage of 1.575V is specified for the SoC security.A minimum of 1.425V are supplied to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FG256 System On Chip (SoC) applications.

  • Flow Sensors
  • Medical Pressure
  • Cyber security for critical applications in the aerospace
  • High-end PLC
  • Transmitters
  • Video Imaging
  • Digital Signal Processing
  • External USB hard disk/SSD
  • Cyberphysical system-on-chip
  • Smartphones