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A2F200M3F-FGG256I

-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-FGG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 651
  • Description: -40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 16 Weeks
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 1997
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Package 256-LBGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops, an important feature to keep in mind.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes MCU - 25, FPGA - 66 I/Os.There is a flash of 256KB on it.Searching A2F200 will yield system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.It uses ARM as its core architecture.There is a 256-pin version of this computer SoC available.In order for the SoC computing to start, -40°C is just about right.There is a design maximum operating temperature of 100°C for this SoC system on chip.A maximum supply voltage of 1.575V is specified for the SoC security.At least 1.425V power is delivered to it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FGG256I System On Chip (SoC) applications.

  • Three phase UPS
  • Remote control
  • Optical drive
  • Healthcare
  • Industrial automation devices
  • External USB hard disk/SSD
  • POS Terminals
  • CNC control
  • Sports
  • Mobile computing