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A2F200M3F-FGG484I

-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 376
  • Description: -40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/OMin 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 100MHz
Base Part Number A2F200
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
Number of I/O MCU - 41, FPGA - 94
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates 200000
Max Frequency 100MHz
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.MCU - 41, FPGA - 94 I/Os in total are included in this SoC part.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC has 484 pins.Just -40°C will start the SoC computing.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.Supply voltage is rated at 1.575V.The SoC security is powered at least by 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-FGG484I System On Chip (SoC) applications.

  • Video Imaging
  • Medical
  • Microcontroller
  • Medical
  • Cyberphysical system-on-chip
  • Networked sensors
  • Temperature
  • ARM Cortex M4 microcontroller
  • Body control module
  • Central inverter