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A2F500M3G-FG256M

256 Terminations-55°C~125°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-FG256M
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 947
  • Description: 256 Terminations-55°C~125°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.5V
Terminal Pitch 1mm
Reach Compliance Code unknown
Frequency 80MHz
Base Part Number A2F500M3G
Number of Outputs 66
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Its package is 256-LBGA.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series name of this system on chip SoC.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.An excessive voltage of 1.575V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 1.425V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 256 terminations.It is possible to use this SoC chip with 66 outputs.This flash has a size of 512KB.Searching A2F500M3G will bring up system on chips with similar specs and purposes.It operates at a frequency of 80MHz.It uses ARM as its core architecture.This is the version with 256 pins.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FG256M System On Chip (SoC) applications.

  • Deep learning hardware
  • Functional safety for critical applications in the automotive
  • Smartphones
  • Transmitters
  • AC drive control module
  • POS Terminals
  • Sports
  • Networked Media Encode/Decode
  • Smart appliances
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