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A2F500M3G-PQ208I

208 Terminations-40°C~100°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-PQ208I
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: 595
  • Description: 208 Terminations-40°C~100°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 208-BFQFP
Surface Mount YES
Number of Pins 208
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2013
Series SmartFusion®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F500M3G
Number of Outputs 66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies 1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 22, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Height Seated (Max) 4.1mm
Length 28mm
Width 28mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.It has been assigned a package 208-BFQFP by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion? series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.This SoC part contains a total of MCU - 22, FPGA - 66 I/Os in total.It is advised to utilize a 1.5V power supply.There is no safe voltage for the SoCs wireless above 1.575V.This SoC system on a chip can run on a power supply that is at least 1.425V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 208 terminations in total, which does really benefit system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 66 outputs.System on chip requires 1.51.82.53.3V power supplies.A 512KB flash can be seen on it.A search for A2F500M3G will result in system on chips that have similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.Core architecture of ARM underpins the SoC meaning.208 pins are present on this computer SoC.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-PQ208I System On Chip (SoC) applications.

  • sequence controllers
  • Robotics
  • Digital Signal Processing
  • Central inverter
  • ARM
  • CNC control
  • USB hard disk enclosure
  • POS Terminals
  • Healthcare
  • Vending machines