All Products

EP1C6F256C7N

2.2mm mm FPGAs Cyclone? Series 256-BGA 1mm mm 256


  • Manufacturer: Intel
  • Origchip NO: 386-EP1C6F256C7N
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 863
  • Description: 2.2mm mm FPGAs Cyclone? Series 256-BGA 1mm mm 256 (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone®
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number EP1C6
JESD-30 Code S-PBGA-B256
Number of Outputs 185
Qualification Status Not Qualified
Power Supplies 1.51.5/3.3V
Number of I/O 185
Clock Frequency 320MHz
Number of Inputs 185
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 5980
Total RAM Bits 92160
Number of LABs/CLBs 598
Height Seated (Max) 2.2mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

EP1C6F256C7N Overview


There is a 256-BGA package that includes this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 185 I/Os are available for transferring data more efficiently. To form a fundamental building block, there are 5980 logic elements/cells. 1.5V volts power it. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 1.425V~1.575V, this device operates with ease. As part of the Cyclone? series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. There are 185 outputs incorporated in this device. It is for space saving reasons that this FPGA model is contained in Tray. In total, it has 256 terminations on each end. Having a RAM bit size of 92160 means that this device will offer you a lot of memory. EP1C6 is the base part number that can be used to identify related parts. This FPGA is built as an array of 598 LABs/CLBs. Power is supplied to the device by a 1.51.5/3.3V battery. Most commonly, this device makes use of an oscillating crystal frequency of 320MHz to operate.

EP1C6F256C7N Features


185 I/Os
Up to 92160 RAM bits

EP1C6F256C7N Applications


There are a lot of Intel EP1C6F256C7N FPGAs applications.

  • OpenCL
  • Artificial intelligence (AI)
  • Military DSP
  • Software-defined radio
  • High Performance Computing
  • Ecosystem
  • Data Center
  • Data Mining
  • ADAS
  • Image processing