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  • IDTSTAC9204X5NBEB2XR

IDTSTAC9204X5NBEB2XR

IDTSTAC9204X5NBEB2XR datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-IDTSTAC9204X5NBEB2XR
  • Package: QFN
  • Datasheet: PDF
  • Stock: 593
  • Description: IDTSTAC9204X5NBEB2XR datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case QFN
Packaging Tape & Reel (TR)
Published 2012
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Resolution 3 B
RoHS Status RoHS Compliant

IDTSTAC9204X5NBEB2XR Overview


Space-saving is achieved by supplying it in the QFN package. This package uses the Tape & Reel (TR) packaging method. On a PCB based on Surface Mount technology, it is mounted. It is set with a maximum value of 70°C to maintain normal operation. To maintain normal use, the operating temperature is set to 0°C.

IDTSTAC9204X5NBEB2XR Features


Embedded in the QFN package

IDTSTAC9204X5NBEB2XR Applications


There are a lot of Integrated Device Technology (IDT) IDTSTAC9204X5NBEB2XR CODECs Interface ICs applications.

  • Data distribution
  • War field flying robot with a using night-vision flying camera
  • Code conversion
  • Image denoising
  • Conveying
  • Automatic health monitoring systems
  • Microprocessor
  • Flight simulators
  • Electronic circuits
  • Automated Guided Vehicles (AGV)