LFE2M35SE-5FN484C

LFE2M35SE-5FN484C Overview

A 484-BBGA package contains it, and it is available for download. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 303 I/Os are programmed to ensure a more coherent data transfer. To form a fundamental building block, there are 34000 logic elements/cells. 1.2V volts power it. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. As part of the ECP2M series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. There are 303 outputs incorporated in this device. As a result of space limitations, this FPGA model has been included in Tray. In total, it has 484 terminations on each end. Having a RAM bit size of 2151424 means that this device will offer you a lot of memory. In order to find related parts, use the part number LFE2M35 as a base. It is crucial that the RAM si262.6kBe of this FPGA module reaches 262.6kB so that the program can run normally. In this case, 484 pins are used in the design. The FPGA is built as an array of 4250 latches or CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. A total of 484 pins are included in this device. Programs and data can be stored in the 271.5kB memory embedded in this FPGA module. A FPGA of this type can achieve a speed as high as 320MHz. Fpga semiconductor incorporates 35000 logic cells used for the building block.

LFE2M35SE-5FN484C Features

303 I/Os
Up to 2151424 RAM bits
484 LABs/CLBs

LFE2M35SE-5FN484C Applications

There are a lot of Lattice Semiconductor Corporation LFE2M35SE-5FN484C FPGAs applications.

• Solar Energy
• Server Applications
• Telecommunication
• Automotive
• Embedded Vision
• Data center hardware accelerators
• Integrating multiple SPLDs
• Wired Communications
• DO-254
• Automotive Applications