LFE2M70SE-6FN900I

LFE2M70SE-6FN900I Overview

A 900-BBGA package contains it, and it is available for download. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 416 I/Os allow data to be transferred in a more coherent manner. A fundamental building block is made up of 67000 logic elements/cells. The supply voltage is 1.2V volts. A Field Programmable Gate Arrays-series FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. The supply voltage of the device is 1.14V~1.26V , at which it runs. It is a type of FPGA that belongs to the ECP2M series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. With this device, you will be able to make use of 416 outputs. There is an FPGA model contained in Tray in order to conserve space. As a whole, it has 900 terminations. This device is equipped with 4642816 RAM bits in terms of its RAM si4642816e. In order to find related parts, you can use its base part number LFE2M70. The RAM si566.8kBe of this FPGA module reaches 566.8kB so as to guarantee the normal operation of the program during operation. In this case, 900 pins are used in the design. A total of 8375 LABs/CLBs make up this FPGA array. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. I am going to present you with a device that is equipped with 900 pins. Most commonly, this device makes use of an oscillating crystal frequency of 357MHz to operate. Data and programs can be stored in this FPGA module's memory of 584.9kB.

LFE2M70SE-6FN900I Features

416 I/Os
Up to 4642816 RAM bits
900 LABs/CLBs

LFE2M70SE-6FN900I Applications

There are a lot of Lattice Semiconductor Corporation LFE2M70SE-6FN900I FPGAs applications.

• Development Boards and Shields for Microcontrollers
• Medical Applications
• Bioinformatics
• Military DSP
• Automotive Applications
• Artificial intelligence (AI)
• Filtering and communication encoding
• Embedded Vision
• High Performance Computing
• ASIC prototyping