LFE3-17EA-8FN484C

LFE3-17EA-8FN484C Overview

The package that contains this software is called 484-BBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. 222 I/Os are available for transferring data more efficiently. There are 17000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. There are many types of FPGAs in the ECP3 series, this is one of them. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. A total of 222 outputs are incorporated into this device. As a space-saving measure, this FPGA model is contained within Tray. 484 terminations are present in total. The RAM bits that this device offer is 716800. Its base part number LFE3-17 can be used to find parts that are related to it. The RAM si87.5kBe of this FPGA module reaches 87.5kB so as to guarantee the normal operation of the program during operation. Fpga electronics is designed wfpga electronics h 484 pins. An array of 2125 LABs/CLBs is built into the FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. A 1.2V-volt supply allows designers to fully utilize its flexibility. Fpga semiconductor is equipped wfpga semiconductorh 484 pin count. Data and programs can be stored in this FPGA module's memory of 92kB. It is possible to achieve a speed of up to 3.1MHz with this FPGA. During operation, it uses 18mA of supply current.

LFE3-17EA-8FN484C Features

222 I/Os
Up to 716800 RAM bits
484 LABs/CLBs

LFE3-17EA-8FN484C Applications

There are a lot of Lattice Semiconductor Corporation LFE3-17EA-8FN484C FPGAs applications.

• Secure Communication
• Industrial Ethernet
• Defense Applications
• Automotive advanced driver assistance systems (ADAS)
• Wired Communications
• Development Boards and Shields for Microcontrollers
• Wireless Communications
• Solar Energy
• Space Applications
• Automotive