LFE3-70EA-8FN672I

LFE3-70EA-8FN672I Overview

There are two packages that contain fpga chips: 672-BBGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 380 I/Os are available for transferring data more efficiently. In order to construct a fundamental building block, 67000 logic elements/cells are required. 1.2V volts power it. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. The supply voltage of the device is 1.14V~1.26V , at which it runs. The ECP3 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. This device is equipped with 380 separate outputs, which makes it a very versatile device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The total number of terminations is 672. The RAM bits that are offered by this fpga chips are 4526080. In order to find related parts, use the part number LFE3-70 as a base. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 672 pins and is designed to connect to a computer. Fpga electronics contains 8375 LABs/CLBs in an array. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. A 1.2V-volt supply allows designers to fully utilize its flexibility. As far as the pin count is concerned, it has 672 pins. This FPGA module embeds a memory of 570.6kB available for storing programs and data. This FPGA can get as fast as 500MHz. The supply current used for its operation is 18mA.

LFE3-70EA-8FN672I Features

380 I/Os
Up to 4526080 RAM bits
672 LABs/CLBs

LFE3-70EA-8FN672I Applications

There are a lot of Lattice Semiconductor Corporation LFE3-70EA-8FN672I FPGAs applications.

• Defense Applications
• Automotive
• Distributed Monetary Systems
• Automation
• Military Temperature
• Image processing
• Aircraft navigation
• Filtering and communication encoding
• Server Applications
• Artificial intelligence (AI)