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  • LPC1768FBD100,551

LPC1768FBD100,551

512KB 512K x 8 FLASH ARM? Cortex?-M3 32-Bit Microcontroller LPC17xx Series LPC1768 3.3V 100-LQFP


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-LPC1768FBD100,551
  • Package: 100-LQFP
  • Datasheet: PDF
  • Stock: 208
  • Description: 512KB 512K x 8 FLASH ARM? Cortex?-M3 32-Bit Microcontroller LPC17xx Series LPC1768 3.3V 100-LQFP (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2010
Series LPC17xx
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Tin (Sn)
Additional Feature PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LPC1768
Pin Count 100
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 2.5/3.33/3.3V
Supply Voltage-Min (Vsup) 2.4V
Oscillator Type Internal
Number of I/O 70
Speed 100MHz
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 2.4V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M3
Peripherals Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Clock Frequency 25MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Bit Size 32
Data Converter A/D 8x12b; D/A 1x10b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
ROM (words) 524288
On Chip Program ROM Width 8
CPU Family ARM7
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS Status ROHS3 Compliant

LPC1768FBD100,551 Overview


Due to its space-saving qualities, it is available in the 100-LQFP package.This is mounted using the Surface Mount method.There is a Tray package available for it.It is equipped with a ARM? Cortex?-M3 core processor.When working, it is recommended that the temperature be kept at -40°C~85°C TA.FLASH is the type of program memory used by it.A total of 70 I/Os are available on this device.A component with the same part number as LPC1768 can be compared to other similar components.QUAD is the position of its terminals on the board.This circuit consists of 100 terminations.LPC17xx is the series number of this electrical component.The 3.3V supply voltage enables high efficiency.This gadget has MICROCONTROLLER, RISC as its uPs/uCs/Peripheral IC.There are 100 pins on it.This component is a part of Microcontrollers.There is 2.5/3.33/3.3V power source in this device.25MHz is the frequency of the device's clock.It belongs to the ARM7 CPU family.In addition, it is also capable of having the property PART, ROHS INFO AND SHIPPING METHOD CONSIDERED FROM MFR WEBSITE.In order to ensure normal operation, the supply voltage (Vsup) must remain above 2.4V.It works with an oscillator type Internal.

LPC1768FBD100,551 Features


100-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory

LPC1768FBD100,551 Applications


There are a lot of NXP USA Inc. LPC1768FBD100,551 Microcontroller applications.

  • Home appliances

  • Automatic control

  • Broadband technology, video and voice processing

  • Instrument control

  • Toys

  • Entertainment products

  • Radio

  • Hard drives

  • ECG machine

  • Guidance-GPS