M2S010-1FG484

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.It is important to note that this SoC security combines FPGA - 10K Logic Modules.Tray package houses this SoC system on a chip.In total, this SoC part has 233 I/Os.As for its flash size, it is 256KB.By searching M2S010, you can find system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.Just 0°C is needed to get the SoC computing up and running.There is a design maximum operating temperature of 85°C for this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S010-1FG484 System On Chip (SoC) applications.

• POS Terminals
• Digital Media
• Networked Media Encode/Decode
• Self-aware system-on-chip (SoC)
• AC drive control module
• Smart appliances
• Keywords
• Video Imaging
• Deep learning hardware
• Cyberphysical system-on-chip