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M2S010T-VFG256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010T-VFG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 459
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes 138 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.There is a possibility that it can be powered by a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 138 outputs.A power supply of 1.2V is required.The SoC chip offers 138 inputs.Logic system on chips features 12084 logic cells.A 256KB flash can be seen on it.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010T-VFG256I System On Chip (SoC) applications.

  • Defense
  • Communication interfaces ( I2C, SPI )
  • Medical
  • Measurement tools
  • ARM
  • Networked sensors
  • Smart appliances
  • Optical drive
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